JP2545363Y2 - スピーカの配線構造 - Google Patents
スピーカの配線構造Info
- Publication number
- JP2545363Y2 JP2545363Y2 JP1989045072U JP4507289U JP2545363Y2 JP 2545363 Y2 JP2545363 Y2 JP 2545363Y2 JP 1989045072 U JP1989045072 U JP 1989045072U JP 4507289 U JP4507289 U JP 4507289U JP 2545363 Y2 JP2545363 Y2 JP 2545363Y2
- Authority
- JP
- Japan
- Prior art keywords
- damper
- conductive portion
- terminal
- wiring structure
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000002093 peripheral effect Effects 0.000 claims description 15
- 238000005476 soldering Methods 0.000 claims description 13
- 238000002788 crimping Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 210000005182 tip of the tongue Anatomy 0.000 description 1
Landscapes
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989045072U JP2545363Y2 (ja) | 1989-04-19 | 1989-04-19 | スピーカの配線構造 |
| KR1019890019388A KR970007296B1 (ko) | 1989-04-19 | 1989-12-23 | 스피커 배선 구조 |
| US07/462,765 US5091958A (en) | 1989-04-19 | 1990-01-10 | Wiring structure of loudspeaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989045072U JP2545363Y2 (ja) | 1989-04-19 | 1989-04-19 | スピーカの配線構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02137198U JPH02137198U (en]) | 1990-11-15 |
| JP2545363Y2 true JP2545363Y2 (ja) | 1997-08-25 |
Family
ID=31558935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989045072U Expired - Lifetime JP2545363Y2 (ja) | 1989-04-19 | 1989-04-19 | スピーカの配線構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2545363Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008199116A (ja) * | 2007-02-08 | 2008-08-28 | Mitsubishi Electric Engineering Co Ltd | 電磁変換器 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55150593U (en]) * | 1979-04-12 | 1980-10-30 | ||
| JPS55162496U (en]) * | 1979-05-08 | 1980-11-21 | ||
| JPS6188397U (en]) * | 1984-11-16 | 1986-06-09 |
-
1989
- 1989-04-19 JP JP1989045072U patent/JP2545363Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02137198U (en]) | 1990-11-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |